電子百科 | 200個常用PCB專業術語中英文互譯

● 安裝孔 mounting hole
● 板 board
● 薄膜 thin film
● 薄膜混合電路 thin film hybrid circuit
● 薄膜開關 membrane switch
● 背板 backplane
● 背鉆 back drilling
● 標志 mark
● 表面處理 surface finish
● 玻璃布 glass fabric
● 玻璃纖維 glass fiber
● 布局 placement
● 布圖設計 layout
● 布線 routing
● 布線完成率 layout efficiency
● 參考基準 datum referan
● 層壓 stack up
● 層壓板 laminate
● 層壓板面 unclad laminate surface
● 傳輸線 transmission line
● 單面覆銅箔層壓板 single-sided copper-clad laminate
● 單面印制板 single-sided printed board (SSB)
● 導電箔 conductive foil
● 導電膠印制板 electroconductive paste printed board
● 導電圖形 conductive pattern
● 導通孔 via
● 導線 conductor trace line
● 導線層 conductor layer
● 導線距離 conductor spacing
● 導線面 conductor side
● 電磁兼容性 electro-magnetic compatibility (EMC)
● 電解銅箔 electrodeposited copper foil (ED copper foil)
● 電纜 cable
● 電路模擬 circuit simulation
● 電子設計自動化 electric design automation (EDA)
● 鍍通孔 plated through hole (PTH)
● 多層印制板 multilayer printed board (MLB)
● 多層印制電路板 multilayer printed circuit board
● 多層印制線路板 multilayer printed wiring board
● 多重布線印制板 multi-wiring printed board
● 非導電圖形 non-conductive pattern
● 非鍍通孔 non-plated through hole (NPTH)
● 非織布 non-woven fabric
● 費用矩陣 cost matrix
● 酚醛樹脂 phenolic resin
● 酚醛紙質覆銅箔板 phenolic cellulose paper copper-clad laminate / phenolic/paper CCL
● 復合層壓板 composite laminate
● 復合金屬箔 composite metallic material
● 覆蓋層 cover layer/lay
● 覆金屬箔基材 metal-clad base material
● 覆銅箔層壓板 copper-clad laminate (CCL)
● 剛撓多層印制板 flex-rigid multilayer printed board, rigid-flex multilayer printed board
● 剛撓雙面印制板 flex-rigid double-sided printed board, rigid-flex double-sided printed board
● 剛撓印制板 flex-rigid printed board, rigid-flex printed board
● 剛性單面印制板 rigid single-sided printed board
● 剛性多層印制板 rigid multilayer printed board
● 剛性雙面印制板 rigid double-sided printed board
● 剛性印制板 rigid printed board
● 高密度互連 high density interconnection
● 工程圖 engineering drawing
● 功能測試 functional test
● 固化劑 curing agent
● 焊接面 solder side
● 焊盤 pad
● 厚膜 thick film
● 厚膜電路 thick film circuit
● 互連 interconnection
● 環氧玻璃布基覆銅箔板 epoxide woven glass fabric copper-clad laminate
● 環氧玻璃布纖維復合覆銅箔板 epoxide non woven/woven glass reinforced copper-clad laminate
● 環氧玻璃布紙復合覆銅箔板 epoxide cellulose paper core, glass cloth surfaces copper-clad laminate
● 環氧玻璃基板 epoxy glass substrate
● 環氧樹脂 epoxy resin
● 環氧紙質覆銅箔板 epoxide cellulose paper copper-clad laminate / epoxy/paper CCL
● 回流焊接 reflow soldering
● 混合電路 hybrid circuit
● 積層多層印制板 build-up multilayer printed board (BUM)
● 積層撓性印制板 build-up flexible printed board
● 積層印制板 build-up printed board
● 基板 substrate
● 基板面 real estate
● 基材 substrate/base material
● 基膜面 base film surface
● 計算機輔助測試 computer-aided test (CAT)
● 計算機輔助工程 computer-aided engineer (CAE)
● 計算機輔助設計 computer-aided design (CAD)
● 計算機輔助制造 computer-aided manufacturing (CAM)
● 計算機集成制造 computer integrated manufacturing (CIM)
● 計算機控制顯示 computer controlled display (CCD)
● 加成法用層壓板 laminate for additive process
● 交互式制圖設計 interactive drawing design
● 膠黏劑 adhesive
● 結晶現象 crystalline polamer
● 金手指 gold fingers
● 金屬基覆銅層壓板 metal base copper-clad laminate
● 金屬基印制板 metal base printed board
● 金屬芯覆銅箔層壓板 metal core copper-clad laminate
● 金屬芯印制板 metal core printed board
● 鏡像 mirroring
● 聚合物 polymer
● 聚酰亞胺樹脂 polyimide resin
● 聚酯薄膜 polyester
● 聚酯玻璃布覆銅箔板 polyester woven glass fabric copper-clad laminate
● 聚酯樹脂 polyester resin
● 可制造性設計 design for manufacturability (DFM)
● 孔環 annular ring
● 孔密度 hole density
● 孔位 hole location
● 連接盤圖形 land pattern
● 邏輯電路 logic circuit
● 邏輯模擬 logic simulation
● 邏輯設計 logic design
● 裸板 bare board
● 埋/盲孔 buried/blind via
● 埋電阻板 buried resistance board
● 埋孔 buried via (hole)
● 盲孔 blind via (hole)
● 模塊化 modularization
● 模擬電路 analog circuit
● 母板 mother board
● 撓性單面印制板 flexible single-sided printed board
● 撓性多層印制板 flexible multilayer printed board
● 撓性覆銅箔絕緣薄膜 flexible copper-clad dielectric film
● 撓性雙面印制板 flexible double-sided printed board
● 撓性印制板 flexible printed board
● 撓性印制電路 flexible printed circuit (FPC)
● 撓性印制線路 flexible printed wiring
● 內層芯板 core material
● 盤中孔/在連接盤中導通孔 via in pad
● 拼板 panel
● 球柵陣列 ball grid array (BGA)
● 驅動文件 drive file
● 去銅箔面 foil removal surface
● 全部鉆孔 all drilled hole
● 熱固性樹脂 thermosetting resin
● 熱塑性樹脂 thermoplastic resin
● 任意層內部導通孔 any layer inner via hole (ALIVH)
● 設計規則檢查 design rule checking
● 設計后處理 post design processing (PDP)
● 拾放 pick and place
● 首件 first article
● 雙列直插式封裝 dual in-line package (DIP)
● 雙面覆銅箔層壓板 double-sided copper-clad laminate
● 雙面印制板 double-sided printed board (DSB)
● 絲印 silkscreen
● 陶瓷基覆銅箔板 ceramics base copper-clad laminate
● 陶瓷印制板 ceramic substrate printed board
● 銅箔 copper foil
● 銅箔面 copper-clad surface
● 圖形 pattern
● 圖形顯示 graphics display
● 涂層；鍍膜 coating
● 網格 grid
● 網絡表 net list
● 微線印制板 micro wire board
● 無連接盤導通孔 landless via hole
● 細間距 fine pitch
● 線網 net
● 壓延銅箔 rolled copper foil
● 引導孔 pilot hole
● 印制板 printed board
● 印制板組裝 printed board assembly
● 印制板組裝圖 printed board assembly drawing
● 印制電路 printed circuit
● 印制電路板 printed circuit board (PCB)
● 印制電路板組裝 printed circuit board assembly (PCBA)
● 印制接點 printed contact
● 印制線路 printed wiring
● 印制線路板 printed wiring board (PWB)
● 印制線路布設 printed wire layout
● 印制組件 printed component
● 優化（設計） optimization (design)
● 有源元件 active component
● 予浸材料/半固化片 prepreg
● 予浸粘結片 preimpregnated bonding sheet
● 預制內層覆箔板 mass lamination panel
● 元件編號 part number
● 原理圖 schematic diagram
● 載芯片板 chip on board (COB)
● 增強板 stiffener
● 增強板材 stiffener material
● 增強材料 reinforcing material
● 粘結層 bonding layer
● 粘結膜 film adhesive
● 粘結片 bonding sheet
● 陣列 array
● 支撐孔 supported hole
● 重布 rerouting
● 裝配圖 assembly drawing
● 子板 daughter board
● 自動光學檢測 automated optical inspection (AOI)
● 字符 legend
● 縱橫比 aspect ratio
● 走（布）線器 router
● 阻焊 solder mask
● 阻燃劑 flame retardant
● 組件安置 component positioning
● 組件孔 component hole
● 組件密度 component density
● 組件面 component side
● 鉆孔圖 drill drawing